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Микросхемы FLASH памяти Samsung Semiconductor

Old Part Number

New Part Number

Organization

Operating

Voltage,
V

Temperature

Package

Production Status

Comments

NAND

KM29W040AT

K9F4008W0A

512K x 8

3.0~5.5

C, I

44 TSOP2

Mass Production

 

KM29W8000T

K9F8008W0M

1M x 8

2.7~5.5

C, I

44 TSOP2

Mass Production

 

KM29W16000AT

K9F1608W0A

2M x 8

2.7~5.5

C , I

44 TSOP2

Mass Production

 

KM29W16000BT

K9F1608W0B

2.7~5.5

C, I

44 TSOP2

Under Development

 

KM29W32000AT

K9F3208W0A

4M x 8

2.7~5.5

C , I

44 TSOP2

Mass Production

 

KM29U64000AT

K9F6408U0A

8M x 8

2.7~3.6

C , I

44 TSOP2

Under Development

 

KM29U64000T

K9F6408U0M

2.7~3.6

C , I

44 TSOP2

Mass Production

 

KM29U128AT

K9F2808U0A

16M x 8

2.7~3.6

C , I

48 TSOP1

Under Development

 

KM29U128T

K9F2808U0M

2.7~3.6

C , I

48 TSOP1

Mass Production

 

KM29U256T

K9F5608U0M

32M x 8

2.7~3.6

C , I

48 TSOP1

Under Development

 

SmartMedia

SMFV002

K9S1608V0A

2M x 8

3.0~3.6

0~55°C

22 PAD

Mass Production

 

SMFV002A

K9S1608V0B

3.0~3.6

0~55°C

22 PAD

Under Development

 

SMFV004A

K9S3208V0A

4M x 8

3.0~3.6

0~55°C

22 PAD

Under Development

 

SMFV004

-

3.0~3.6

0~55°C

22 PAD

Mass Production

 

SMFV008A

K9S6408V0A

8M x 8

2.7~3.6

0~55°C

22 PAD

Under Development

 

SMFV008

K9S6408V0M

2.7~3.6

0~55°C

22 PAD

Mass Production

 

SMFV016A

K9S2808V0A

16M x 8

2.7~3.6

0~55°C

22 PAD

Under Development

 

SMFV016

K9S2808V0M

2.7~3.6

0~55°C

22 PAD

Mass Production

 

SMFDV032

K9D5608V0M

32M x 8

2.7~3.6

0~55°C

22 PAD

Mass Production

Dual Chip

SMFV032

K9S5608V0M

2.7~3.6

0~55°C

22 PAD

Under Development

 

SMFDV064

K9D1208V0M

64M x 8

2.7~3.6

0~55°C

22 PAD

Under Development

Dual Chip

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